Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.
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The design of these products depends on the production method and require careful consideration of dimensions and tolerances and tooling design.
Conformal coating is a thin insulating coating applied by various methods. Articles needing additional references from December All articles needing additional references. A designer pacmages balance many objectives and practical considerations when selecting packaging methods. Vacuum potting works best with resins that cure by polymerization, rather than solvent evaporation.
Parts are submerged in a polymerizable monomer or solvent-based low viscosity plastic solution. Packaging for aerospace, marine, or military electronlc imposes different types of design criteria.
Pl can be post-processed to provide conductive surfaces.
Electronic packaging – Wikipedia
In earlier times it was often used to discourage reverse engineering of proprietary products built as printed circuit modules. Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures.
An electronics assembly consists of component devices, circuit card assemblies CCAsconnectors, cables and components such as transformers, power supplies, relays, switches, etc. Today it is most widely used to protect semiconductor hermiticlty from moisture and mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together.
Punched and formed sheet metal is one of the oldest types of electronic packaging. It provides mechanical and chemical protection of delicate components.
Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes.
The main application of vacuum impregnation porosity sealing is in boosting the dielectric strength of transformers, solenoids, lamination stacks or coils, and some high voltage components. Industrial design Packaging Packaging microfabrication Chip carriers. Gasketed metal castings are sometimes used to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water.
When void-free potting is required, it is common practice to place the product in a vacuum chamber while the resin is still liquid, hold a vacuum for several minutes to draw the air out of internal cavities and the resin itself, then release the vacuum.
Retrieved from ” https: December Learn how and when to remove this template message. This article needs additional citations packgaes verification. This type of packaging can also be divided into two main types: This page was last edited on 31 Decemberat Atmospheric pressure collapses the voids and forces the liquid resin into all internal spaces.
Liquid filling is sometimes used as an alternative to potting or impregnation. Electronic packages are sometimes made by machining solid blocks of metal, usually aluminum, into complex shapes. This industry developed the glass-seal electrical feedthrough, using alloys such as Kovar to match the coefficient of expansion of the sealing glass so as to minimize mechanical stress on the critical metal-glass bond as the tube warmed up.
Padkages can be rigid or soft. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge.
In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments. It’s usually a dielectric fluid, chosen for chemical compatibility with the other materials present.
Quantities tend to be small; sometimes only one unit of a custom design is required. This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage.
Some later tubes used metal electrronic and feedthroughs, and only the insulation around the individual feedthroughs used glass. Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology.
Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics. From Wikipedia, the free encyclopedia. These requirements extend beyond and interact with the electrical design. In these, the individual diodes are mounted in an array that allows the device to produce a greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface mount types, individually on a circuit board.